TLV6002IDGKT
vs
MCP6002T-I/P
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TSSOP,
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2016-06-19
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.000076 µA
|
|
| Bias Current-Max (IIB) @25C |
0.000076 µA
|
|
| Common-mode Reject Ratio-Min |
60 dB
|
|
| Common-mode Reject Ratio-Nom |
76 dB
|
|
| Input Offset Voltage-Max |
4500 µV
|
|
| JESD-30 Code |
S-PDSO-G8
|
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
2
|
|
| Neg Supply Voltage Limit-Max |
-3.5 V
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.1 mm
|
|
| Slew Rate-Nom |
0.5 V/us
|
|
| Supply Current-Max |
0.2 mA
|
|
| Supply Voltage Limit-Max |
3.5 V
|
|
| Surface Mount |
YES
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Unity Gain BW-Nom |
1000
|
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
|
|
|
Compare TLV6002IDGKT with alternatives
Compare MCP6002T-I/P with alternatives