TMM2016BP-12 vs 8403615LA feature comparison

TMM2016BP-12 Toshiba America Electronic Components

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8403615LA Defense Logistics Agency

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Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer TOSHIBA CORP DEFENSE LOGISTICS AGENCY
Package Description DIP, DIP24,.6 CERAMIC, DIP-24
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Samacsys Manufacturer Toshiba
Access Time-Max 12 ns 120 ns
Additional Feature LG-MAX
I/O Type COMMON
JESD-30 Code R-PDIP-T24 R-GDIP-T24
JESD-609 Code e0
Length 32.4 mm 32.004 mm
Memory Density 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 2KX8 2KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Qualified
Seated Height-Max 5 mm 5.08 mm
Standby Current-Max 0.005 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology MOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 7.62 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-STD-883
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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