Parametric results for: 岫岩少妇交友+服务941803261_Φ扣zbt under SRAMs

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Memory IC Type: ZBT SRAM
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71V2556S100PFG8
Integrated Device Technology Inc
$4.5114 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-F100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY QFF QFP100,.63X.87 RECTANGULAR FLATPACK YES MATTE TIN FLAT 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, GREEN, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
71V546S100PFG8
Integrated Device Technology Inc
$4.5114 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
71V2546S150BG8
Integrated Device Technology Inc
$4.5114 No No Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 119 BG119 not_compliant 3A991.B.2.A 8542.32.00.41
71V2556S166PFG8
Integrated Device Technology Inc
$4.5114 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.5 ns 166 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 350 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-F100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY QFF QFP100,.63X.87 RECTANGULAR FLATPACK YES MATTE TIN FLAT 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, GREEN, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
71V2546S150PFG8
Integrated Device Technology Inc
$4.5114 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, GREEN, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
71V2546S133BG8
Integrated Device Technology Inc
$4.5114 No No Transferred 4.7186 Mbit 36 128KX36 3.3 V 4.2 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 300 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 119 BG119 not_compliant 3A991.B.2.A 8542.32.00.41
71V3556S100PFG8
Integrated Device Technology Inc
$4.5114 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
71V3558S100PFG8
Integrated Device Technology Inc
$4.5114 Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1998-08-01
71V2546S100PFG8
Integrated Device Technology Inc
$4.5114 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, GREEN, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
71V2546S100BG8
Integrated Device Technology Inc
$4.5114 No No Transferred 4.7186 Mbit 36 128KX36 3.3 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 119 BG119 not_compliant 3A991.B.2.A 8542.32.00.41