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IS61NLF102418B-7.5TQLI-TR
Integrated Silicon Solution Inc
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$1.0000 | Yes | Yes | Active | 18.8744 Mbit | 18 | 1MX18 | 3.3 V | 7.5 ns | ZBT SRAM | FLOW-THROUGH | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED SILICON SOLUTION INC | LQFP, | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||||||
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71V3559S80PFG8
Integrated Device Technology Inc
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$3.8377 | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 8 ns | 95 MHz | ZBT SRAM | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 250 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP-100 | compliant | 3A991.B.2.A | 8542.32.00.41 | TQFP | 100 | PKG100 | 1998-08-01 | |||||
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71V3559S85PFG8
Integrated Device Technology Inc
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$3.8377 | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 8.5 ns | 90 MHz | ZBT SRAM | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 225 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP-100 | compliant | 3A991.B.2.A | 8542.32.00.41 | TQFP | 100 | PKG100 | 1998-08-01 | |||||
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71V547S100PFG8
Integrated Device Technology Inc
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$4.2185 | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 5 ns | 66 MHz | ZBT SRAM | FLOW-THROUGH | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 200 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-F100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | QFF | QFP100,.63X.87 | RECTANGULAR | FLATPACK | YES | MATTE TIN | FLAT | 635 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | 14 X 20 MM, GREEN, PLASTIC, TQFP-100 | compliant | 3A991.B.2.A | 8542.32.00.41 | TQFP | 100 | PKG100 | 1998-04-01 | |||||||
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71V547S80PFG8
Integrated Device Technology Inc
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$4.2185 | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 5 ns | 95 MHz | ZBT SRAM | FLOW-THROUGH | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 250 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-F100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | QFF | QFP100,.63X.87 | RECTANGULAR | FLATPACK | YES | MATTE TIN | FLAT | 635 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | 14 X 20 MM, GREEN, PLASTIC, TQFP-100 | compliant | 3A991.B.2.A | 8542.32.00.41 | TQFP | 100 | PKG100 | 1998-04-01 | |||||||
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AS8C403601-QC166N
Alliance Memory Inc
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$4.3712 | Yes | Yes | Active | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 3.5 ns | ZBT SRAM | PIPELINED ARCHITECTURE | 1 | 128000 | 131.072 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | 3 | 70 °C | 260 | 40 | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | ALLIANCE MEMORY INC | 14 X 20 MM, ROHS COMPLIANT, PLASTIC, MO-136DJ, TQFP-100 | compliant | 3A991.B.2.A | 8542.32.00.41 | QFP | 100 | Alliance Memory | ||||||||||||||
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AS8C403625-QC75N
Alliance Memory Inc
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$4.3712 | Yes | Yes | Active | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | 117 MHz | ZBT SRAM | FLOW THROUGH | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 3.14 V | 255 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3/e6 | 3 | 70 °C | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | ALLIANCE MEMORY INC | LQFP, QFP100,.63X.87 | compliant | 3A991.B.2.A | 8542.32.00.41 | QFP | 100 | Alliance Memory | ||||||||
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AS8C401801-QC166N
Alliance Memory Inc
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$4.3712 | Yes | Yes | Active | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 3.5 ns | ZBT SRAM | PIPELINED ARCHITECTURE | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | 3 | 70 °C | 260 | 40 | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | ALLIANCE MEMORY INC | LQFP, | compliant | 3A991.B.2.A | 8542.32.00.41 | QFP | 100 | Alliance Memory | ||||||||||||||
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71V546S133PFG
Integrated Device Technology Inc
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$4.4409 | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 4.2 ns | 133 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 300 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | 14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100 | compliant | 3A991.B.2.A | 8542.32.00.41 | TQFP | 100 | PKG100 | 1998-04-01 | |||
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71V547S80PFGI8
Integrated Device Technology Inc
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$4.4821 | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 5 ns | 95 MHz | ZBT SRAM | FLOW-THROUGH | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 45 mA | 3.14 V | 260 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-F100 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | QFF | QFP100,.63X.87 | RECTANGULAR | FLATPACK | YES | MATTE TIN | FLAT | 635 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | 14 X 20 MM, GREEN, PLASTIC, TQFP-100 | compliant | 3A991.B.2.A | 8542.32.00.41 | TQFP | 100 | PKG100 | 1998-04-01 |