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SY88933ALKG
Microchip Technology Inc
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$4.5952 | Yes | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 39 mA | INDUSTRIAL | S-PDSO-G10 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICROCHIP TECHNOLOGY INC | LEAD FREE, MSOP-10 | compliant | EAR99 | 8542.39.00.01 | Microchip | ||||||
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ONET1101LRGER
Texas Instruments
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$4.6462 | Yes | Yes | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 118 mA | OTHER | S-PQCC-N24 | e4 | Not Qualified | 2 | 100 °C | -25 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | TEXAS INSTRUMENTS INC | VQFN-24 | compliant | 5A991.B.1 | 8542.39.00.01 | Texas Instruments | QFN | 24 | |||
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SY88803VKG
Micrel Inc
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$4.6928 | Yes | Transferred | 3.3 V | BIPOLAR | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 42 µA | INDUSTRIAL | S-PDSO-G10 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICREL INC | 3 MM, LEAD FREE, MSOP-10 | compliant | ||||||||
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MAX3945ETE+
Maxim Integrated Products
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$4.7502 | Yes | Yes | Transferred | 3.3 V | CMOS | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 1 | 62 mA | INDUSTRIAL | S-XQCC-N16 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, TQFN-16 | compliant | EAR99 | 8542.33.00.01 | QFN | 16 | ||||
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SY88923VKG-TR
Microchip Technology Inc
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$4.7520 | Yes | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | 1 | INDUSTRIAL | S-PDSO-G10 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 10 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICROCHIP TECHNOLOGY INC | 3 MM, LEAD FREE, MSOP-10 | compliant | 8542.39.00.01 | |||||||||||||
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SY88903ALKG
Microchip Technology Inc
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$4.7802 | Yes | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 39 mA | INDUSTRIAL | S-PDSO-G10 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICROCHIP TECHNOLOGY INC | LEAD FREE, MSOP-10 | compliant | EAR99 | 8542.39.00.01 | Microchip | ||||||
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SY88903VKG
Microchip Technology Inc
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$4.8370 | Yes | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | SONET | 1 | 42 mA | INDUSTRIAL | S-PDSO-G10 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICROCHIP TECHNOLOGY INC | 3 X 3 MM, LEAD FREE, MSOP-10 | compliant | EAR99 | 8542.39.00.01 | Microchip | ||||||
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ONET1191PRGTT
Texas Instruments
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$5.0026 | Yes | Yes | Active | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 49 mA | INDUSTRIAL | S-PQCC-N16 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 1 mm | TEXAS INSTRUMENTS INC | QFN-16 | compliant | 5A991.B.1 | 8542.39.00.01 | Texas Instruments | QFN | 16 | |||
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SY88303BLEY
Microchip Technology Inc
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$5.0245 | Yes | Obsolete | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | 1 | INDUSTRIAL | S-PDSO-G10 | e3 | Not Qualified | 85 °C | -40 °C | 10 | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICROCHIP TECHNOLOGY INC | LEAD FREE, MSOP-10 | compliant | 8542.39.00.01 | Microchip | |||||||||||||
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MIC3001GML
Microchip Technology Inc
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$5.3295 | Yes | Not Recommended | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | SDH; SONET | 1 | 3.5 mA | INDUSTRIAL | S-XQCC-N24 | e4 | Not Qualified | 2 | 105 °C | -40 °C | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 900 µm | MICROCHIP TECHNOLOGY INC | 4 X 4 MM, LEAD FREE, MLF-24 | compliant | EAR99 | 8542.39.00.01 | Microchip |