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Parametric » Telecommunication Circuits » Digital Transmission Support

Parametric results for: 米兰洲际酒店桑拿＋【719893330_Φ.扣】ela under Digital Transmission Support

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Telecom IC Type: ELASTIC BUFFER
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DS2175N
 Maxim Integrated Products 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA INDUSTRIAL R-PDIP-T16 e0 Not Qualified 1 85 °C -40 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.175 mm 4.572 mm MAXIM INTEGRATED PRODUCTS INC DIP 0.300 INCH, DIP-16 16 not_compliant EAR99 8542.32.00.71
XR-2135ACP
 Exar Corporation 		Check for Price No Obsolete 5 V CMOS 19 Mbps ELASTIC BUFFER 1 10 mA COMMERCIAL R-PDIP-T14 e0 Not Qualified 70 °C 14 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.304 mm 5.334 mm EXAR CORP DIP DIP, 14 unknown 8542.39.00.01
DS2175
 Rochester Electronics LLC 		Check for Price No No Active 5 V CMOS ELASTIC BUFFER 1 COMMERCIAL R-PDIP-T16 e0 COMMERCIAL 1 70 °C 240 20 16 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.175 mm 4.572 mm ROCHESTER ELECTRONICS INC DIP DIP, 16 unknown
DS2176QN
 Dallas Semiconductor 		Check for Price No Transferred 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 µA INDUSTRIAL S-PQCC-J28 e0 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 11.5062 mm 11.5062 mm 4.57 mm DALLAS SEMICONDUCTOR PLASTIC, LCC-28 unknown
LXP2175SC
 Intel Corporation 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 COMMERCIAL R-PDSO-G16 e0 Not Qualified 70 °C 16 PLASTIC/EPOXY SOP SOP16,.3 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm INTEL CORP SOIC SOP, SOP16,.3 16 compliant 8542.39.00.01
LXP2175NE
 Level One 		Check for Price No Transferred 5 V CMOS ELASTIC BUFFER 1 INDUSTRIAL R-PDIP-T16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL LEVEL ONE DIP, DIP16,.3 unknown 8542.39.00.01
DS2175S
 Rochester Electronics LLC 		Check for Price No No Active 5 V CMOS ELASTIC BUFFER 1 COMMERCIAL R-PDSO-G16 e0 COMMERCIAL 1 70 °C 245 NOT SPECIFIED 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm ROCHESTER ELECTRONICS INC SOIC SOP, 16 unknown
DS2175SN+T&R
 Maxim Integrated Products 		Check for Price Yes Yes Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA INDUSTRIAL R-PDSO-G16 e3 Not Qualified 1 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm MAXIM INTEGRATED PRODUCTS INC SOIC SOP, SOP16,.4 16 compliant 8542.39.00.01
LXP2175NE
 Intel Corporation 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 INDUSTRIAL R-PDIP-T16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 5.84 mm INTEL CORP DIP DIP, DIP16,.3 16 compliant 8542.39.00.01
DS2175SN+
 Maxim Integrated Products 		Check for Price Yes Yes Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA INDUSTRIAL R-PDSO-G16 e3 Not Qualified 1 85 °C -40 °C 260 30 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm MAXIM INTEGRATED PRODUCTS INC SOIC SOP, SOP16,.4 16 compliant EAR99 8542.32.00.71
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