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W25Q32BWZEIG
Winbond Electronics Corp
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Check for Price | Yes | Active | 33.5544 Mbit | 8 | 4MX8 | 1.8 V | 80 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | SPI | 5 µA | 24 µA | 1.95 V | 1.65 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-XDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | UNSPECIFIED | VSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | WINBOND ELECTRONICS CORP | SON | VSON, SOLCC8,.3 | 8 | compliant | EAR99 | 8542.32.00.51 | ||||||
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W25Q32BWZPIP
Winbond Electronics Corp
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Check for Price | Yes | Active | 33.5544 Mbit | 8 | 4MX8 | 1.8 V | 80 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | SPI | 5 µA | 24 µA | 1.95 V | 1.65 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-XDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | UNSPECIFIED | VSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | SON | VSON, SOLCC8,.25 | 8 | compliant | EAR99 | 8542.32.00.51 | ||||||
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W25Q32BWZPIG
Winbond Electronics Corp
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Check for Price | Yes | Active | 33.5544 Mbit | 8 | 4MX8 | 1.8 V | 80 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | SPI | 5 µA | 24 µA | 1.95 V | 1.65 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-XDSO-N8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | UNSPECIFIED | VSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | SON | WSON-8 | 8 | compliant | EAR99 | 8542.32.00.51 | ||||
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W25Q32BVZPIG
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 8 | 4MX8 | 3 V | 80 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 5 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | SON | 6 X 5 MM, GREEN, WSON-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Winbond | |||||
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W25Q32BVTBIP
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 8 | 4MX8 | 3 V | 80 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 5 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | WINBOND ELECTRONICS CORP | 8 X 6 MM, GREEN, TFBGA-24 | compliant | EAR99 | 8542.32.00.51 | ||||||||
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W25Q32BVTCAP
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 8 | 4MX8 | 3 V | 80 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 5 µA | 18 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 105 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,4X6,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | WINBOND ELECTRONICS CORP | BGA | TBGA, BGA24,4X6,40 | 24 | compliant | EAR99 | 8542.32.00.51 | ||||||
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W25Q32BVDAAG
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 8 | 4MX8 | 3 V | 80 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 5 µA | 18 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDIP-T8 | Not Qualified | 105 °C | -40 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 9.27 mm | 7.62 mm | WINBOND ELECTRONICS CORP | DIP | DIP, DIP8,.3 | 8 | compliant | EAR99 | 8542.32.00.51 | ||||||
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W25Q32BVZEAP
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 8 | 4MX8 | 3 V | 80 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 5 µA | 18 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 105 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | WINBOND ELECTRONICS CORP | SON | HVSON, SOLCC8,.3 | 8 | compliant | EAR99 | 8542.32.00.51 | ||||||
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W25Q32BVZEBP
Winbond Electronics Corp
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Check for Price | Obsolete | 33.5544 Mbit | 8 | 4MX8 | 3 V | 80 MHz | FLASH | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-N8 | 85 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | WINBOND ELECTRONICS CORP | HVSON, | compliant | EAR99 | 8542.32.00.51 | |||||||||||||||||
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W25Q32BVSFBP
Winbond Electronics Corp
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Check for Price | Obsolete | 33.5544 Mbit | 8 | 4MX8 | 3 V | 80 MHz | FLASH | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G16 | 85 °C | -40 °C | AEC-Q100 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.64 mm | 10.31 mm | 7.49 mm | WINBOND ELECTRONICS CORP | SOP, | compliant | EAR99 | 8542.32.00.51 |