0805B103K251CT
vs
HC0805XR103K251
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
FENGHUA ADVANCED TECHNOLOGY
|
MERITEK ELECTRONICS CORP
|
| Package Description |
, 0805
|
CHIP
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Capacitance |
0.01 µF
|
0.01 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
1.25 mm
|
1.25 mm
|
| Length |
2 mm
|
2.1 mm
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
10%
|
10%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
Tape, Paper
|
TR, Plastic, 7 Inch
|
| Positive Tolerance |
10%
|
10%
|
| Rated (DC) Voltage (URdc) |
250 V
|
250 V
|
| Size Code |
0805
|
0805
|
| Temperature Characteristics Code |
X7R
|
X7R
|
| Temperature Coefficient |
15% ppm/°C
|
15% ppm/°C
|
| Terminal Finish |
PURE COPPER
|
TIN OVER NICKEL
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| HTS Code |
|
8532.24.00.20
|
| JESD-609 Code |
|
e3
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare 0805B103K251CT with alternatives
Compare HC0805XR103K251 with alternatives