1N3305R
vs
JAN1N2804RB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DO-5
|
|
| Package Description |
HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
|
HERMETIC SEALED, TO-3, 2 PIN
|
| Pin Count |
1
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Additional Feature |
PD-CASE
|
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
0.2 Ω
|
|
| JEDEC-95 Code |
DO-203AB
|
TO-204AD
|
| JESD-30 Code |
O-MUPM-D1
|
O-MBFM-P2
|
| Knee Impedance-Max |
70 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
2
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
50 W
|
50 W
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Reference Voltage-Nom |
6.8 V
|
6.8 V
|
| Reverse Current-Max |
300 µA
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
SOLDER LUG
|
PIN/PEG
|
| Terminal Position |
UPPER
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Voltage Temp Coeff-Max |
2.72 mV/°C
|
|
| Voltage Tol-Max |
20%
|
5%
|
| Working Test Current |
1850 mA
|
1850 mA
|
| Base Number Matches |
25
|
1
|
| Factory Lead Time |
|
35 Weeks
|
| JESD-609 Code |
|
e0
|
| Reference Standard |
|
MIL-19500/114
|
| Terminal Finish |
|
TIN LEAD OVER NICKEL
|
|
|
|
Compare 1N3305R with alternatives
Compare JAN1N2804RB with alternatives