1N3329RA vs 1N2828RAE3 feature comparison

1N3329RA Microchip Technology Inc

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1N2828RAE3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN O-MBFM-P2
Reach Compliance Code compliant compliant
Additional Feature PD-CASE
Case Connection CATHODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 4.5 Ω 4.5 Ω
JEDEC-95 Code DO-203AB TO-204AD
JESD-30 Code O-MUPM-D1 O-MBFM-P2
Knee Impedance-Max 100 Ω
Number of Elements 1 1
Number of Terminals 1 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style POST/STUD MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 50 W 50 W
Qualification Status Not Qualified
Reference Voltage-Nom 45 V 45 V
Reverse Current-Max 10 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form SOLDER LUG PIN/PEG
Terminal Position UPPER BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Temp Coeff-Max 40.5 mV/°C
Voltage Tol-Max 10% 10%
Working Test Current 280 mA 280 mA
Base Number Matches 1 1
Part Package Code TO-3
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
JESD-609 Code e3
Terminal Finish MATTE TIN

Compare 1N3329RA with alternatives

Compare 1N2828RAE3 with alternatives