1N4735A,113
vs
1N4735AP/TR12
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DO-4
|
|
| Package Description |
HERMETIC SEALED PACKAGE-2
|
DO-41, 2 PIN
|
| Pin Count |
2
|
|
| Manufacturer Package Code |
SOD66
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Factory Lead Time |
4 Weeks
|
20 Weeks
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
2 Ω
|
2 Ω
|
| JEDEC-95 Code |
DO-41
|
DO-204AL
|
| JESD-30 Code |
O-LALF-W2
|
O-PALF-W2
|
| JESD-609 Code |
e3
|
|
| Knee Impedance-Max |
700 Ω
|
700 Ω
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1 W
|
1 W
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
6.2 V
|
6.2 V
|
| Reverse Current-Max |
10 µA
|
10 µA
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
41 mA
|
41 mA
|
| Base Number Matches |
2
|
2
|
| Reference Standard |
|
MIL-STD-750
|
| Reverse Test Voltage |
|
3 V
|
|
|
|
Compare 1N4735A,113 with alternatives
Compare 1N4735AP/TR12 with alternatives