1N5314-1
vs
1N5314-1E3
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
M/A-COM TECHNOLOGY SOLUTIONS INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.70
|
|
| Additional Feature |
HIGH SOURCE IMPEDANCE
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| JEDEC-95 Code |
DO-7
|
DO-7
|
| JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
| Limiting Voltage-Max |
2.9 V
|
2.9 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Regulation Current-Nom (Ireg) |
4.7 mA
|
4.7 mA
|
| Surface Mount |
NO
|
NO
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
7
|
2
|
| Package Description |
|
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
|
| Factory Lead Time |
|
21 Weeks
|
| Dynamic Impedance-Min |
|
235000 Ω
|
| Rep Pk Reverse Voltage-Max |
|
100 V
|
| Terminal Finish |
|
Pure Matte Tin (Sn)
|
|
|
|
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