1N5809US
vs
1N5809US
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
M/A-COM TECHNOLOGY SOLUTIONS INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.80
|
|
Application |
ULTRA FAST RECOVERY POWER
|
ULTRA FAST RECOVERY
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
Non-rep Pk Forward Current-Max |
125 A
|
125 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
3 A
|
3 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Reverse Recovery Time-Max |
0.03 µs
|
0.03 µs
|
Surface Mount |
YES
|
YES
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Base Number Matches |
5
|
7
|
Rohs Code |
|
No
|
Package Description |
|
HERMETIC SEALED, GLASS, MELF-2
|
Factory Lead Time |
|
24 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Additional Feature |
|
HIGH RELIABILITY, METALLURGICALLY BONDED
|
JESD-609 Code |
|
e0
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-65 °C
|
Terminal Finish |
|
TIN LEAD OVER NICKEL
|
|
|
|
Compare 1N5809US with alternatives
Compare 1N5809US with alternatives