1N5819M vs 1N5819G feature comparison

1N5819M General Instrument Corp

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1N5819G Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer GENERAL INSTRUMENT CORP MICROSEMI CORP
Package Description GLASS, MELF-2 HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code unknown unknown
Additional Feature LOW POWER LOSS HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code O-LELF-R2 O-LALF-W2
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Operating Temperature-Max 125 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Output Current-Max 1 A 1 A
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 40 V 40 V
Surface Mount YES NO
Technology SCHOTTKY SCHOTTKY
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Base Number Matches 1 2
Rohs Code No
Part Package Code DO-41
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.80
JEDEC-95 Code DO-41
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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