1N821E3 vs JANTX1N821-1 feature comparison

1N821E3 Microsemi Corporation

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JANTX1N821-1 Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description DIE-3 DO-35, 2 PIN
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-204AH
JESD-30 Code S-XXSS-N3 O-LALF-W2
Number of Elements 1 1
Number of Terminals 3 2
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style SPECIAL SHAPE LONG FORM
Power Dissipation-Max 0.475 W 0.5 W
Reference Voltage-Nom 6.2 V 6.2 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Form NO LEAD WIRE
Terminal Position UNSPECIFIED AXIAL
Voltage Temp Coeff-Max 0.62 mV/°C 0.62 mV/°C
Voltage Tol-Max 4.84% 5%
Base Number Matches 2 12
Pbfree Code No
Rohs Code No
Part Package Code DO-7
Pin Count 2
Dynamic Impedance-Max 15 Ω
JESD-609 Code e0
Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C
Qualification Status Not Qualified
Reference Standard MIL-19500
Reverse Current-Max 2 µA
Reverse Test Voltage 3 V
Terminal Finish TIN LEAD
Working Test Current 7.5 mA

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