1SS381
vs
934055282115
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
TOSHIBA CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOD
|
SC-79
|
Package Description |
R-PDSO-F2
|
ULTRA SMALL, PLASTIC, SMD, UFP, SC-79, 2 PIN
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.60
|
8541.10.00.60
|
Breakdown Voltage-Min |
30 V
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance-Max |
1.2 pF
|
1.05 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
MIXER DIODE
|
MIXER DIODE
|
Forward Voltage-Max (VF) |
0.85 V
|
|
Frequency Band |
VERY HIGH FREQUENCY
|
VERY HIGH FREQUENCY
|
JESD-30 Code |
R-PDSO-F2
|
R-PDSO-F2
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
150 °C
|
Output Current-Max |
100 A
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
30 V
|
|
Reverse Current-Max |
0.1 µA
|
|
Surface Mount |
YES
|
YES
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e3
|
Operating Temperature-Min |
|
-65 °C
|
Power Dissipation-Max |
|
0.715 W
|
Technology |
|
PLANAR DOPED BARRIER
|
Terminal Finish |
|
TIN
|
|
|
|
Compare 1SS381 with alternatives
Compare 934055282115 with alternatives