24AA64-I/CS16K vs S-93C56BD0H-T8T2U feature comparison

24AA64-I/CS16K Microchip Technology Inc

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S-93C56BD0H-T8T2U ABLIC Inc.

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer MICROCHIP TECHNOLOGY INC ABLIC INC
Part Package Code BGA SOIC
Package Description ROHS COMPLIANT, CSP-4 TSSOP-8
Pin Count 4 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz 8 MHz
JESD-30 Code R-PBGA-B4 R-PDSO-G8
JESD-609 Code e1 e3
Memory Density 65536 bit 2048 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 4 8
Number of Words 8192 words 128 words
Number of Words Code 8000 128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8KX8 128X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.55 mm 1.1 mm
Serial Bus Type I2C 3-WIRE
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.7 V 1.8 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin (Sn)
Terminal Form BALL GULL WING
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Write Cycle Time-Max (tWC) 5 ms 2 ms
Base Number Matches 1 1
Additional Feature 100 YEAR DATA RETENTION
Data Retention Time-Min 100
Length 4.4 mm
Terminal Pitch 0.65 mm
Width 3 mm

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