24LC16BT-I/OT
vs
24LC16BT-I/SL
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
SOT-23, 5 PIN
|
0.150 INCH, PLASTIC, SOIC-14
|
| Reach Compliance Code |
unknown
|
compliant
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
0.4 MHz
|
| Data Retention Time-Min |
200
|
200
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
1010MMMR
|
1010MMMR
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G14
|
| Length |
2.9 mm
|
8.65 mm
|
| Memory Density |
16384 bit
|
16384 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
14
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
2000
|
2000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2KX8
|
2KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
SOP
|
| Package Equivalence Code |
TSOP5,.11,37
|
SOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
5 V
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.45 mm
|
1.75 mm
|
| Serial Bus Type |
I2C
|
I2C
|
| Standby Current-Max |
0.000001 A
|
0.00003 A
|
| Supply Current-Max |
0.003 mA
|
0.003 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.6 mm
|
3.9 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
10 ms
|
| Write Protection |
HARDWARE
|
HARDWARE
|
| Base Number Matches |
4
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Additional Feature |
|
1000K ERASE/WRITE CYCLES; CAN BE ORGANIZED AS 8 BLOCKS OF 256 BYTES; DATA RETENTION >200 YEARS
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Output Characteristics |
|
OPEN-DRAIN
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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