24LC64TI/SNG vs M24128-BWMN3TPB feature comparison

24LC64TI/SNG Microchip Technology Inc

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M24128-BWMN3TPB STMicroelectronics

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC STMICROELECTRONICS
Part Package Code SOIC SOIC
Package Description SOP, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e3 e4
Length 4.9 mm 4.9 mm
Memory Density 65536 bit 131072 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8192 words 16384 words
Number of Words Code 8000 16000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8KX8 16KX8
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 5 V 2.7 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish MATTE TIN NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Width 3.91 mm 3.9 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Base Number Matches 1 1

Compare 24LC64TI/SNG with alternatives

Compare M24128-BWMN3TPB with alternatives