25AA160B-I/WF15K
vs
25AA160TSN
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
WAFER
|
0.150 INCH, PLASTIC, SOIC-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
ALSO OPERATES WITH 1.8VMIN@3MHZ
|
DATA RETENTION > 200 YEARS; 4KV ESD PROTECTION; 1M ENDURANCE CYCLES
|
| Clock Frequency-Max (fCLK) |
10 MHz
|
1 MHz
|
| Data Retention Time-Min |
200
|
200
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| JESD-30 Code |
R-XUUC-N
|
R-PDSO-G8
|
| Memory Density |
16384 bit
|
16384 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
2000
|
2000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
2KX8
|
2KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
SOP
|
| Package Equivalence Code |
DIE OR CHIP
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
5 V
|
|
| Screening Level |
TS 16949
|
|
| Serial Bus Type |
SPI
|
SPI
|
| Standby Current-Max |
0.000001 A
|
|
| Supply Current-Max |
0.006 mA
|
0.005 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UPPER
|
DUAL
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Write Protection |
HARDWARE
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Date Of Intro |
|
1996-05-10
|
| JESD-609 Code |
|
e3
|
| Length |
|
4.9 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
8
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.75 mm
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
3.9 mm
|
|
|
|
Compare 25AA160B-I/WF15K with alternatives
Compare 25AA160TSN with alternatives