2964B
vs
AM2964BDC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
PHILIPS COMPONENTS
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
,
|
DIP, DIP40,.6
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
16
|
16
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
|
|
| Low Power Mode |
NO
|
NO
|
| Number of Banks |
4
|
4
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
MEMORY CONTROLLER, DRAM
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
40
|
| JESD-30 Code |
|
R-GDIP-T40
|
| Length |
|
52.2605 mm
|
| Memory Organization |
|
176K X 8
|
| Number of Terminals |
|
40
|
| Package Body Material |
|
CERAMIC, GLASS-SEALED
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP40,.6
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
5.588 mm
|
| Supply Current-Max |
|
173 mA
|
| Surface Mount |
|
NO
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
15.24 mm
|
|
|
|
Compare 2964B with alternatives
Compare AM2964BDC with alternatives