2N5547
vs
SI6966DQ-T1-E3
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SOLITRON DEVICES INC
|
VISHAY SILICONIX
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SEPARATE, 2 ELEMENTS
|
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
|
| FET Technology |
JUNCTION
|
METAL-OXIDE SEMICONDUCTOR
|
| JEDEC-95 Code |
TO-71
|
|
| JESD-30 Code |
O-MBCY-W6
|
R-PDSO-G8
|
| Number of Elements |
2
|
2
|
| Number of Terminals |
6
|
8
|
| Operating Mode |
DEPLETION MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
200 °C
|
|
| Package Body Material |
METAL
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
CYLINDRICAL
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
0.25 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Terminal Form |
WIRE
|
GULL WING
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
4
|
1
|
| Part Package Code |
|
TSSOP
|
| Package Description |
|
TSSOP-8
|
| Pin Count |
|
8
|
| DS Breakdown Voltage-Min |
|
20 V
|
| Drain Current-Max (ID) |
|
4 A
|
| Drain-source On Resistance-Max |
|
0.03 Ω
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare 2N5547 with alternatives
Compare SI6966DQ-T1-E3 with alternatives