2N6671
vs
2N6317
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
METAL CAN-2
|
TO-66, 2 PIN
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Samacsys Manufacturer |
Microsemi Corporation
|
Microchip
|
| Collector Current-Max (IC) |
8 A
|
7 A
|
| Collector-Emitter Voltage-Max |
300 V
|
60 V
|
| DC Current Gain-Min (hFE) |
10
|
4
|
| JEDEC-95 Code |
TO-3
|
TO-213AA
|
| JESD-30 Code |
O-MBFM-P2
|
O-MBFM-P2
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Polarity/Channel Type |
NPN
|
PNP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD OVER NICKEL
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
36 Weeks
|
| Case Connection |
|
COLLECTOR
|
| Collector-Base Capacitance-Max |
|
300 pF
|
| Configuration |
|
SINGLE
|
| Fall Time-Max (tf) |
|
800 ns
|
| Number of Elements |
|
1
|
| Operating Temperature-Max |
|
200 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Power Dissipation-Max (Abs) |
|
90 W
|
| Rise Time-Max (tr) |
|
700 ns
|
| Transistor Application |
|
SWITCHING
|
| Turn-off Time-Max (toff) |
|
1800 ns
|
| VCEsat-Max |
|
2 V
|
|
|
|
Compare 2N6671 with alternatives
Compare 2N6317 with alternatives