5962-8403701CX vs MC74HC00ANG feature comparison

5962-8403701CX Defense Logistics Agency

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MC74HC00ANG onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer DEFENSE LOGISTICS AGENCY ON SEMICONDUCTOR
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 150 ns 110 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.69 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 4 2
Source Content uid MC74HC00ANG
Pbfree Code Yes
Rohs Code Yes
ECCN Code EAR99
JESD-30 Code R-PDIP-T14
JESD-609 Code e3
Length 18.86 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Number of Terminals 14
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 22 ns
Schmitt Trigger NO
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

Compare 5962-8403701CX with alternatives

Compare MC74HC00ANG with alternatives