5962-8513302QA vs Z8002BD1 feature comparison

5962-8513302QA Intel Corporation

Buy Now

Z8002BD1 STMicroelectronics

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP STMICROELECTRONICS
Package Description DIP, DIP40,.6 DIP,
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16
Bit Size 80 16
Boundary Scan NO NO
Clock Frequency-Max 8 MHz 10 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
JESD-30 Code R-XDIP-T40 R-CDIP-T40
JESD-609 Code e0
Number of Terminals 40 40
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Speed 8 MHz 10 MHz
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology HMOS MOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
Part Package Code DIP
Pin Count 40
Integrated Cache NO
Low Power Mode YES
Number of DMA Channels
Number of External Interrupts 3
Number of Serial I/Os
On Chip Data RAM Width
RAM (words) 0
Seated Height-Max 3.6 mm
Supply Current-Max 300 mA
Width 15.24 mm

Compare 5962-8513302QA with alternatives

Compare Z8002BD1 with alternatives