5962-8606301XA vs M27C256B-20B7 feature comparison

5962-8606301XA QP Semiconductor

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M27C256B-20B7 STMicroelectronics

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, PLASTIC, DIP-28
Pin Count 28 28
Reach Compliance Code unknown not_compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 200 ns 200 ns
JESD-30 Code R-GDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 105 °C
Operating Temperature-Min -55 °C -40 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
I/O Type COMMON
Length 37.085 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP28,.6
Programming Voltage 12.75 V
Seated Height-Max 5.08 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare 5962-8606301XA with alternatives

Compare M27C256B-20B7 with alternatives