5962-8606301XA vs NMC27C256BNE200 feature comparison

5962-8606301XA QP Semiconductor

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NMC27C256BNE200 National Semiconductor Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 200 ns 200 ns
JESD-30 Code R-GDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
I/O Type COMMON
Length 35.725 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP28,.6
Programming Voltage 12.75 V
Seated Height-Max 5.334 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare 5962-8606301XA with alternatives

Compare NMC27C256BNE200 with alternatives