5962-87515073A
vs
MB7144-EWCV
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
WQCCN,
|
METAL SEALED, CERAMIC, LCC-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.32.00.61
|
|
| Access Time-Max |
35 ns
|
65 ns
|
| Additional Feature |
POWER SWITCHED PROM
|
|
| JESD-30 Code |
S-CQCC-N28
|
S-CQCC-N28
|
| JESD-609 Code |
e0
|
|
| Length |
11.43 mm
|
11.43 mm
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
UVPROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
8KX8
|
8KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
WQCCN
|
QCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, WINDOW
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.8956 mm
|
2.16 mm
|
| Supply Current-Max |
0.12 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
11.43 mm
|
11.43 mm
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare 5962-87515073A with alternatives
Compare MB7144-EWCV with alternatives