5962-8776202VA
vs
AD7575JP
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIP
|
|
| Package Description |
0.960 X 0.310 INCH, CERDIP-18
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
18
|
20
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
2.46 V
|
2.46 V
|
| Analog Input Voltage-Min |
|
|
| Conversion Time-Max |
15 µs
|
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-GDIP-T18
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
e0
|
| Linearity Error-Max (EL) |
0.2%
|
0.4%
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
20
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Bit Code |
BINARY
|
OFFSET BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP18,.3
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Sample and Hold / Track and Hold |
TRACK
|
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
7 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
3
|
|
|
|
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