5962-8776303LX
vs
MX7537TQ/883
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
DEFENSE LOGISTICS AGENCY
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
CERAMIC, DIP-24
|
|
Reach Compliance Code |
unknown
|
not_compliant
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY
|
BINARY, OFFSET BINARY
|
Input Format |
PARALLEL, 8 BITS
|
|
JESD-30 Code |
R-GDIP-T24
|
R-XDIP-T24
|
Linearity Error-Max (EL) |
0.0244%
|
0.012%
|
Number of Bits |
12
|
12
|
Number of Functions |
2
|
2
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
38535Q/M;38534H;883B
|
Supply Voltage-Nom |
15 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
1
|
Rohs Code |
|
No
|
Part Package Code |
|
DIP
|
Pin Count |
|
24
|
ECCN Code |
|
3A001.A.2.C
|
HTS Code |
|
8542.39.00.01
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
DIP24,.3
|
Settling Time-Max |
|
1.5 µs
|
Supply Current-Max |
|
2 mA
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare 5962-8776303LX with alternatives
Compare MX7537TQ/883 with alternatives