5962-8852514XX
vs
5962-8852516UX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
0.600 INCH, CERAMIC, DIP-28
CERAMIC, PGA-28
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
150 ns
150 ns
Additional Feature
AUTOMATIC WRITE
AUTOMATIC WRITE
JESD-30 Code
R-GDIP-T28
R-CPGA-P28
JESD-609 Code
e0
e0
Length
37.215 mm
16.51 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
PGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
MIL-STD-883 Class C
Seated Height-Max
5.72 mm
4.4 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
PERPENDICULAR
Width
15.24 mm
13.97 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
1
1
Date Of Intro
1998-10-01
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Compare 5962-8852516UX with alternatives