5962-8866203XX vs EDI8833P55CB feature comparison

5962-8866203XX Pyramid Semiconductor Corporation

Buy Now

EDI8833P55CB Electronic Designs Inc

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP ELECTRONIC DESIGNS INC
Part Package Code DIP
Package Description DIP,
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-GDIP-T28 R-CDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 14 1
Rohs Code No
I/O Type COMMON
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES
Package Equivalence Code DIP28,.6
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.0009 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.125 mA
Terminal Pitch 2.54 mm

Compare 5962-8866203XX with alternatives

Compare EDI8833P55CB with alternatives