5962-8866209NA vs HM65256ASP-20 feature comparison

5962-8866209NA QP Semiconductor

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HM65256ASP-20 Hitachi Ltd

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC HITACHI LTD
Part Package Code DIP DIP
Package Description DIP, DIP, DIP28,.3
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 100 ns
JESD-30 Code R-GDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM PSEUDO STATIC RAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
I/O Type COMMON
Length 36 mm
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES
Package Equivalence Code DIP28,.3
Seated Height-Max 5.08 mm
Standby Current-Max 0.0006 A
Supply Current-Max 0.065 mA
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare 5962-8866209NA with alternatives

Compare HM65256ASP-20 with alternatives