5962-8873502LB vs 5962-8873503LX feature comparison

5962-8873502LB Waferscale Integration Inc

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5962-8873503LX Cypress Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC CYPRESS SEMICONDUCTOR CORP
Package Description DIP, DIP, DIP24,.3
Reach Compliance Code unknown unknown
Access Time-Max 200 ns 25 ns
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0
Length 31.877 mm
Memory Density 65536 bit 16384 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 8000 2000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 2KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.12 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 4
Part Package Code DIP
Pin Count 24
ECCN Code EAR99
HTS Code 8542.32.00.71
I/O Type COMMON
Output Characteristics REGISTERED
Package Equivalence Code DIP24,.3
Programming Voltage 12.5 V
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.12 A

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