5962-89841013X vs 5962-8984101LA feature comparison

5962-89841013X AMD

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5962-8984101LA Rochester Electronics LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ROCHESTER ELECTRONICS LLC
Part Package Code QFN DIP
Package Description QCCN, DIP,
Pin Count 28 24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature PAL WITH MACROCELLS; 10 MACROCELLS VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET
Clock Frequency-Max 22 MHz 25 MHz
JESD-30 Code S-CQCC-N28 R-GDIP-T24
Length 11.43 mm 31.9405 mm
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Terminals 28 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code QCCN DIP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Programmable Logic Type EE PLD EE PLD
Propagation Delay 30 ns 30 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm 7.62 mm
Base Number Matches 1 1
JESD-609 Code e0
Terminal Finish TIN LEAD

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