5962-9080304MLX vs 5962-9080304MLA feature comparison

5962-9080304MLX Teledyne e2v

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5962-9080304MLA Cypress Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description 0.300 INCH, CERDIP-24 CERAMIC, DIP-24
Pin Count 24 24
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 200 ns 25 ns
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Memory Density 1048576 bit 65536 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 128000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 8KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Supply Current-Max 0.125 mA 0.14 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 3
Rohs Code No
Additional Feature POWER SWITCHED PROM
I/O Type COMMON
JESD-609 Code e0
Length 31.877 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.3
Seated Height-Max 5.08 mm
Standby Current-Max 0.05 A
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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