5962-9080304MLX vs CY7C261-35WMB feature comparison

5962-9080304MLX QP Semiconductor

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CY7C261-35WMB Cypress Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, 0.300 INCH, WINDOWED, CERDIP-24
Pin Count 24 24
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.71 8542.32.00.61
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Memory Density 65536 bit 65536 bit
Memory IC Type OTP ROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 2
Rohs Code No
Access Time-Max 35 ns
Additional Feature POWER SWITCHED PROM
I/O Type COMMON
JESD-609 Code e0
Length 31.877 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.3
Seated Height-Max 5.08 mm
Standby Current-Max 0.03 A
Supply Current-Max 0.12 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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Compare CY7C261-35WMB with alternatives