66AK2H12DAAWA24
vs
66AK2H12DAAW24
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
FCBGA-1517
|
FCBGA-1517
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A991.B
|
5A991.B
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2017-07-27
|
2017-07-27
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| JESD-30 Code |
S-PBGA-B1517
|
S-PBGA-B1517
|
| JESD-609 Code |
e1
|
e1
|
| Length |
40 mm
|
40 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Terminals |
1517
|
1517
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Seated Height-Max |
3.62 mm
|
3.62 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
40 mm
|
40 mm
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 66AK2H12DAAWA24 with alternatives
Compare 66AK2H12DAAW24 with alternatives