66AK2H12DAAWA24
vs
66AK2H12DXAAWA24
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
FCBGA-1517
|
FCBGA-1517
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A991.B
|
5A002.A
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2017-07-27
|
2017-07-27
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
JESD-30 Code |
S-PBGA-B1517
|
S-PBGA-B1517
|
JESD-609 Code |
e1
|
e1
|
Length |
40 mm
|
40 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of Terminals |
1517
|
1517
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Seated Height-Max |
3.62 mm
|
3.62 mm
|
Supply Voltage-Max |
1.05 V
|
1.05 V
|
Supply Voltage-Min |
0.95 V
|
0.95 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
40 mm
|
40 mm
|
uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 66AK2H12DAAWA24 with alternatives
Compare 66AK2H12DXAAWA24 with alternatives