7005S55GG8
vs
7005L55GGI8
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
PGA,
|
PGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
55 ns
|
55 ns
|
JESD-30 Code |
S-CPGA-P68
|
S-CPGA-P68
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
DUAL-PORT SRAM
|
DUAL-PORT SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
68
|
Number of Words |
8192 words
|
8192 words
|
Number of Words Code |
8000
|
8000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
8KX8
|
8KX8
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
PGA
|
PGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e3
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare 7005S55GG8 with alternatives
Compare 7005L55GGI8 with alternatives