7006S55PFI vs 5962-9150812MYA feature comparison

7006S55PFI Integrated Device Technology Inc

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5962-9150812MYA Defense Logistics Agency

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC DEFENSE LOGISTICS AGENCY
Part Package Code QFP
Package Description 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 FP-68
Pin Count 64
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 55 ns 20 ns
Additional Feature BATTERY BACKUP OPERATION
I/O Type COMMON
JESD-30 Code S-PQFP-G64 S-XQFP-F68
JESD-609 Code e0 e0
Length 14 mm 24.08 mm
Memory Density 131072 bit 131072 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 2
Number of Terminals 64 68
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code LQFP DFP
Package Equivalence Code QFP64,.66SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Qualified
Seated Height-Max 1.6 mm 3.68 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING FLAT
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm 24 mm
Base Number Matches 4 1
Screening Level MIL-STD-883

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