7133SA25JG vs IDT7133LA25PFGI feature comparison

7133SA25JG Integrated Device Technology Inc

Buy Now Datasheet

IDT7133LA25PFGI Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description LCC-68 LFQFP,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
JESD-30 Code S-PQCC-N68 S-PQFP-G100
Memory Density 32768 bit 32768 bit
Memory IC Type DUAL-PORT SRAM MULTI-PORT SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 68 100
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2KX16 2KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCN LFQFP
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Position QUAD QUAD
Base Number Matches 8 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code QFP
Pin Count 100
JESD-609 Code e3
Length 14 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Terminal Finish Matte Tin (Sn)
Terminal Pitch 0.5 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

Compare 7133SA25JG with alternatives

Compare IDT7133LA25PFGI with alternatives