72235LB10PF9 vs 72235LB10PFG8 feature comparison

72235LB10PF9 Integrated Device Technology Inc

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72235LB10PFG8 Renesas Electronics Corporation

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC RENESAS ELECTRONICS CORP
Part Package Code QFP TQFP
Package Description PLASTIC, TQFP-64
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 NLR
HTS Code 8542.32.00.71 8542320071
Access Time-Max 40 ns 6.5 ns
Cycle Time 50 ns 10 ns
JESD-30 Code S-PQFP-G64 R-PQFP-G64
JESD-609 Code e0 e3
Length 14 mm
Memory Density 36864 bit 36864 bit
Memory IC Type OTHER FIFO BI-DIRECTIONAL FIFO
Memory Width 9 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 2048 words 2048 words
Number of Words Code 4000 2000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX9 2KX18
Output Enable NO YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Supply Current-Max 0.15 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 14 mm
Base Number Matches 2 1
Manufacturer Package Code PNG64
Factory Lead Time 26 Weeks, 1 Day
Samacsys Manufacturer Renesas Electronics
Standby Current-Max 0.005 A

Compare 72235LB10PF9 with alternatives

Compare 72235LB10PFG8 with alternatives