72401L10SOG8 vs 5962-8952305EX feature comparison

72401L10SOG8 Integrated Device Technology Inc

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5962-8952305EX Cypress Semiconductor

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Package Description SOIC-16 DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 55 ns 55 ns
Additional Feature FALL THRU 65NS
Cycle Time 100 ns 100 ns
JESD-30 Code R-PDSO-G16 R-GDIP-T16
Length 10.3 mm 19.43 mm
Memory Density 256 bit 256 bit
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 64 words 64 words
Number of Words Code 64 64
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64X4 64X4
Output Enable NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 2.65 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.62 mm
Base Number Matches 1 1
Part Package Code DIP
Pin Count 16
Clock Frequency-Max (fCLK) 10 MHz
Memory IC Type OTHER FIFO
Output Characteristics 3-STATE
Package Equivalence Code DIP16,.3
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Supply Current-Max 0.09 mA

Compare 72401L10SOG8 with alternatives

Compare 5962-8952305EX with alternatives