74F765-1N
vs
D82C03
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SIGNETICS CORP
|
INTEL CORP
|
Package Description |
,
|
WDIP, DIP40,.6
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
18
|
14
|
Boundary Scan |
NO
|
NO
|
Bus Compatibility |
68020; 68000; 8086; Z-80
|
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDIP-T48
|
R-GDIP-T40
|
Low Power Mode |
NO
|
NO
|
Memory Organization |
256K X 1
|
|
Number of Banks |
1
|
4
|
Number of Terminals |
48
|
40
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE, WINDOW
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
170 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
MEMORY CONTROLLER, DRAM
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Length |
|
52.325 mm
|
Package Code |
|
WDIP
|
Package Equivalence Code |
|
DIP40,.6
|
Seated Height-Max |
|
5.72 mm
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
15.24 mm
|
|
|
|
Compare 74F765-1N with alternatives
Compare D82C03 with alternatives