74HC138DTR2G vs 74HCT238U feature comparison

74HC138DTR2G onsemi

Buy Now Datasheet

74HCT238U NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI NXP SEMICONDUCTORS
Part Package Code TSSOP WAFER
Package Description LEAD FREE, TSSOP-16 DIE,
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Family HC/UH HCT
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 X-XUUC-N
JESD-609 Code e4
Length 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED TRUE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSSOP DIE
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR UNSPECIFIED
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH UNCASED CHIP
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 41 ns
Propagation Delay (tpd) 205 ns 53 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) 40
Width 4.4 mm
Base Number Matches 1 1

Compare 74HC138DTR2G with alternatives

Compare 74HCT238U with alternatives