74HCT132N,652 vs HD74HC132P-E feature comparison

74HCT132N,652 NXP Semiconductors

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HD74HC132P-E Renesas Electronics Corporation

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Source Content uid 74HCT132N,652 HD74HC132P-E
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 DIP,
Pin Count 14 14
Manufacturer Package Code SOT27-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e4 e4
Length 19.025 mm 19.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method BULK
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Power Supplies 5 V
Prop. Delay@Nom-Sup 41 ns
Propagation Delay (tpd) 50 ns 125 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES
Seated Height-Max 4.2 mm 5.06 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
Moisture Sensitivity Level 1

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