74HCT1G66GW,125 vs 74HCT1G66GW feature comparison

74HCT1G66GW,125 NXP Semiconductors

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74HCT1G66GW Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code TSSOP
Package Description 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5 TSSOP-5
Pin Count 5
Manufacturer Package Code SOT353-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2 mm 2 mm
Moisture Sensitivity Level 1 1
Normal Position NO NO
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 5 5
Off-state Isolation-Nom 50 dB 50 dB
On-state Resistance-Max (Ron) 142 Ω 142 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08 TSSOP5,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Switch-off Time-Max 53 ns 53 ns
Switch-on Time-Max 36 ns 36 ns
Switching MAKE-BEFORE-BREAK MAKE-BEFORE-BREAK
Technology CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 3
Date Of Intro 1998-08-03
Supply Current-Max (Isup) 0.02 mA

Compare 74HCT1G66GW,125 with alternatives

Compare 74HCT1G66GW with alternatives