74HCT1G66GW-T
vs
74HCT1G66GW,125
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-02-01
|
|
Analog IC - Other Type |
SPST
|
SPST
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
TSSOP
|
Pin Count |
|
5
|
Manufacturer Package Code |
|
SOT353-1
|
JESD-30 Code |
|
R-PDSO-G5
|
JESD-609 Code |
|
e3
|
Length |
|
2 mm
|
Moisture Sensitivity Level |
|
1
|
Normal Position |
|
NO
|
Number of Channels |
|
1
|
Number of Functions |
|
1
|
Number of Terminals |
|
5
|
Off-state Isolation-Nom |
|
50 dB
|
On-state Resistance-Max (Ron) |
|
142 Ω
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TSSOP
|
Package Equivalence Code |
|
TSSOP5/6,.08
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
YES
|
Switch-off Time-Max |
|
53 ns
|
Switch-on Time-Max |
|
36 ns
|
Switching |
|
MAKE-BEFORE-BREAK
|
Technology |
|
CMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Finish |
|
Tin (Sn)
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Width |
|
1.25 mm
|
|
|
|
Compare 74HCT1G66GW-T with alternatives
Compare 74HCT1G66GW,125 with alternatives