74HCT4067N,112 vs MC14067BDWG feature comparison

74HCT4067N,112 NXP Semiconductors

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MC14067BDWG onsemi

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Part Package Code DIP SOIC−24 WB
Package Description DIP, DIP24,.6 SOIC-24
Pin Count 24 24
Manufacturer Package Code SOT101-1 0.0751
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER
JESD-30 Code R-PDIP-T24 R-PDSO-G24
JESD-609 Code e3 e3
Length 31.7 mm 15.395 mm
Number of Channels 16 16
Number of Functions 1 1
Number of Terminals 24 24
Off-state Isolation-Nom 50 dB 40 dB
On-state Resistance Match-Nom 9 Ω 25 Ω
On-state Resistance-Max (Ron) 180 Ω 1050 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP24,.6 SOP24,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 2.65 mm
Signal Current-Max 0.025 A 0.025 A
Supply Current-Max (Isup) 0.08 mA 0.6 mA
Supply Voltage-Max (Vsup) 5.5 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Switch-off Time-Max 90 ns 625 ns
Switch-on Time-Max 98 ns 600 ns
Switching BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish TIN MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 7.5 mm
Base Number Matches 1 1
Pbfree Code Yes
Factory Lead Time 9 Weeks
Samacsys Manufacturer onsemi
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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Compare MC14067BDWG with alternatives